| Mfg Part Number: UXA2S220 | Manufacturer: Semi General Inc |
| NSN : 5961-01-165-5170 | NIIN : 011655170 |
| Item Name : semiconductor devic | CAGE Code : 3BBY6 |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your interest in our available UXA2S220 NSN part. This part number UXA2S220 is a Semiconductor Devic listed under the FSC 5961 Semiconductor Devices and Associated Hardware, and it is manufactured by Semi General Inc. At Internet of Components, all of our stock and inventory are available for purchase today, ready to ship with short lead times and competitive pricing. Whether you are in need of parts that are new, used, or obsolete, our team of industry experts is readily available 24/7x365 to fulfill all of your operational
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Internet of Components is a premier supplier of UXA2S220 NSN component, and we carry recently requested NSN components such as 5961011655170. We strive to only provide our customers with quality parts, which is why we choose to source our inventory from thousands of global manufacturers such as Semi General Inc. If you are interested in this particular item, we invite you to begin the purchasing process for UXA2S220 today by filling out and submitting an Instant RFQ. Once received, a member of our staff will review and reach out to you in 15 minutes or less to provide a personalized quote that caters towards your individual needs. Get started on the purchasing process today and see how we are revolutionizing the purchasing process.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-165-5170 Item Description: Semiconductor Devic | 5961 | 011655170 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| UXA2S220 | C | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.050 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.055 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.0 MINIMUM BREAKDOWN VOLTAGE, DC |
| CTRD | POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR PRESET |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.08 NOMINAL |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
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