| Mfg Part Number: IM6561MJN 883B | Alternate P/N: IM6561MJN883B |
| Manufacturer: Intersil Corporation | NSN : 5962-01-122-4432 |
| NIIN : 011224432 | Item Name : microcircuit memory |
| CAGE Code : 32293 | FSC : 5962 Microcircuits Electronic |
Thank you for your interest in our available IM6561MJN 883B NSN part. This part number IM6561MJN 883B is a Microcircuit Memory listed under the FSC 5962 Microcircuits Electronic, and it is manufactured by Intersil Corporation. At Internet of Components, all of our stock and inventory are available for purchase today, ready to ship with short lead times and competitive pricing. Whether you are in need of parts that are new, used, or obsolete, our team of industry experts is readily available 24/7x365 to fulfill all of your operational
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Internet of Components is a premier supplier of IM6561MJN 883B NSN component, and we carry recently requested NSN components such as 5962011224432. We strive to only provide our customers with quality parts, which is why we choose to source our inventory from thousands of global manufacturers such as Intersil Corporation. If you are interested in this particular item, we invite you to begin the purchasing process for IM6561MJN 883B today by filling out and submitting an Instant RFQ. Once received, a member of our staff will review and reach out to you in 15 minutes or less to provide a personalized quote that caters towards your individual needs. Get started on the purchasing process today and see how we are revolutionizing the purchasing process.
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.885 INCHES MINIMUM AND 0.915 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.145 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | 5811-01-088-0549 80058 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT AND SYNCHRONOUS AND HIGH PERFORMANCE AND LOW POWER |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 8.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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