Mfg Part Number: H8708 | Manufacturer: Intel Corporation |
NSN : 5962-01-047-2035 | NIIN : 010472035 |
Item Name : microcircuit memory | CAGE Code : 34649 |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in our available H8708 NSN part. This part number H8708 is a Microcircuit Memory listed under the FSC 5962 Microcircuits Electronic, and it is manufactured by Intel Corporation. At Internet of Components, all of our stock and inventory are available for purchase today, ready to ship with short lead times and competitive pricing. Whether you are in need of parts that are new, used, or obsolete, our team of industry experts is readily available 24/7x365 to fulfill all of your operational
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Internet of Components is a premier supplier of H8708 NSN component, and we carry recently requested NSN components such as 5962010472035. We strive to only provide our customers with quality parts, which is why we choose to source our inventory from thousands of global manufacturers such as Intel Corporation. If you are interested in this particular item, we invite you to begin the purchasing process for H8708 today by filling out and submitting an Instant RFQ. Once received, a member of our staff will review and reach out to you in 15 minutes or less to provide a personalized quote that caters towards your individual needs. Get started on the purchasing process today and see how we are revolutionizing the purchasing process.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-047-2035 Item Description: Microcircuit Memory | 5962 | 010472035 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | U | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
H8708 | 3 | 1 | C |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.200 INCHES MINIMUM AND 1.300 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.320 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND HIGH SPEED AND 3-STATE OUTPUT AND PROGRAMMABLE AND W/DECODED OUTPUT AND W/BUFFERED OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND METAL |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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