Mfg Part Number: IDT72V36100L15PFI | Manufacturer: Integrated Device Technology Inc |
NSN : 5962-01-589-8596 | NIIN : 015898596 |
Item Name : microcircuit memory | CAGE Code : 61772 |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in our available IDT72V36100L15PFI NSN part. This part number IDT72V36100L15PFI is a Microcircuit Memory listed under the FSC 5962 Microcircuits Electronic, and it is manufactured by Integrated Device Technology Inc. At Internet of Components, all of our stock and inventory are available for purchase today, ready to ship with short lead times and competitive pricing. Whether you are in need of parts that are new, used, or obsolete, our team of industry experts is readily available 24/7x365 to fulfill all of your operational
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Internet of Components is a premier supplier of IDT72V36100L15PFI NSN component, and we carry recently requested NSN components such as 5962015898596. We strive to only provide our customers with quality parts, which is why we choose to source our inventory from thousands of global manufacturers such as Integrated Device Technology Inc. If you are interested in this particular item, we invite you to begin the purchasing process for IDT72V36100L15PFI today by filling out and submitting an Instant RFQ. Once received, a member of our staff will review and reach out to you in 15 minutes or less to provide a personalized quote that caters towards your individual needs. Get started on the purchasing process today and see how we are revolutionizing the purchasing process.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-589-8596 Item Description: Microcircuit Memory | 5962 | 015898596 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
IDT72V36100L15PFI | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | Operating Temp Range | -40.0/+85.0 DEG CELSIUS |
ADAU | Body Height | 1.6 MILLIMETERS MAXIMUM |
CBBL | Features Provided | ASYNCHRONOUS AND SYNCHRONOUS AND PROGRAMMABLE AND HIGH PERFORMANCE |
TTQY | Terminal Type And Quantity | 128 GULLWING |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CWSG | Terminal Surface Treatment | SOLDER |
CQSZ | Inclosure Configuration | FLAT PACK |
ABHP | Overall Length | 21.9 MILLIMETERS MINIMUM AND 22.1 MILLIMETERS MAXIMUM |
ADAT | Body Width | 13.9 MILLIMETERS MINIMUM AND 14.1 MILLIMETERS MAXIMUM |
CXCY | Part Name Assigned By Controlling Agency | 3.3 VOLT HIGH DENSITY SUPERSYNC II 36 BIT FIFO 65,536 X 36 |
MRC | Decoded Requirement | Clear Text Reply |
ADAQ | Body Length | 19.9 MILLIMETERS MINIMUM AND 20.1 MILLIMETERS MAXIMUM |
CTFT | Case Outline Source And Designator | MS-026BHB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CQSJ | Inclosure Material | PLASTIC |
ABMK | Overall Width | 15.9 MILLIMETERS MINIMUM AND 16.1 MILLIMETERS MAXIMUM |
CZEQ | Time Rating Per Chacteristic | 15.00 NANOSECONDS NOMINAL ACCESS |
CZEN | Voltage Rating And Type Per Characteristic | 3.3 VOLTS NOMINAL INPUT |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZER | Memory Device Type | FIRST-IN FIRST-OUT |
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